Comlent Commences Volume Shipment of RF Power Amplifier for Digital Enhanced Cordless Telephony (DECT) Standard in European Market
Comlent, China's leading fabless radio-frequency integrated circuit (RFIC) design house headquartered in Shanghai Zhangjiang High Tech Park, announced today that it has begun volume shipment of an RF power amplifier (PA) targeted for the Digital Enhanced Cordless Telephony (DECT) standard in the European market.
SHANGHAI, China (PRWEB) February 28, 2005 -- Comlent, a fabless
radio-frequency integrated circuit (RFIC) design house headquartered in Shanghai
Zhangjiang High Tech Park, announced today that it has begun volume shipment of
an RF power amplifier (PA) targeted for the Digital Enhanced Cordless Telephony
(DECT) standard in the European market.
The Comlent
PA operates at 1.9GHz and utilizes Jazz Semiconductor’s 0.35um BiCMOS process.
It has a 3-stage design that offers up to 30dB gain and 24-dBm of output power.
A specially designed QFN-16 package is used to provide good electrical
performance and heat conduction.
The DECT digital cordless phone market
in Europe has experienced strong growth in recent years, with approximately 30
million units shipped in 2003. In addition, the DECT market expects further
growth due to the transition of the North American cordless phone market from
the existing 2.4GHz Digital Spread Spectrum (DSS) technology to the DECT
standard, which began early this year. The combined cordless phone market of
Europe and North America is expected to exceed 60 million phones per year, which
translates into a market demand of greater than 120 million DECT power
amplifiers.
Comlent’s investors include leading venture capital
institutional investors such as Intel Capital, 3i and Draper Fisher Jurvetson,
Shanghai municipal and Zhangjiang High Tech Park venture funds as well as top
executives from several leading semiconductor companies in the US, Taiwan and
Europe.
“In the past two and a half years, Comlent has invested millions
of U.S. dollars in R&D to develop proprietary and patented IP for RFIC
designs in both CMOS and BiCMOS technologies. Comlent’s recent sampling of
China’s first complete RFIC transceiver and PA, which leverages Jazz
Semiconductor’s modular BiCMOS process, coupled with the swift market acceptance
of Comlent’s PA for DECT phones in the European market further supports
Comlent’s market and product positioning as well as our technology capability
and leadership in China,” says co-founder and CEO of Comlent, Dr. Kai Chen.
“Comlent will relentlessly strengthen and execute our business vision and
mission to provide world class RFIC technology, along with technical support,
service and quality, to enable our customers to win in the domestic and global
marketplaces.”
“Jazz Semiconductor is pleased to support Comlent, one of
China's leading RFIC design houses, in addressing the rapidly growing wireless
terminal market in China,” stated Paul Kempf, chief technology and marketing
officer at Jazz Semiconductor. “Comlent’s continued success in meeting both
technology and business milestones further reinforces our confidence and
commitment to these emerging markets."
About Comlent:
Established in
2002, Comlent, a fabless radio frequency integrated circuit (RFIC) design house
headquartered in Zhangjiang High Tech Park, Shanghai, China, is a leading RFIC
provider that focuses on the exploding wireless communication market of China.
Initial products of Comlent include RFIC transceivers in both CMOS and BiCMOS
technologies for mobile handsets in 1.9GHz-2.4GHz frequency range. Comlent
provides enabling RFIC technology, strong support and quality service to serve
China’s mobile communication market that has 300+ million mobile phone and 70
million PHS/PAS subscribers, 400 million domestic TV sets and manufacturers of
70 million cordless phone units per year. For more information, please visit www.Comlent.com.
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Source : http://www.prweb.com/releases/2005/2/prweb210102.htm